A3
Through-holeBuilt for the through-hole line.
AI inspection for through-hole assemblies before and after wave soldering. Alongside standard THT solder joint and bridge checks, dedicated AI algorithms detect missing, incorrect and reversed components.
Key specifications.
Compare optics, board capacity and handling specifications to find the right fit for your production.
Metric specifications are shown with approximate imperial equivalents.
Warpage and thickness limits, the full inspection item list, software functions and integration detail are in the brochure rather than on this page.
Explore our inspection capabilities and plant integration features. Available checks depend on the machine and configuration.
The same core AI software across the range.
Auto-programming, feedback learning, model training and offline operation are standard on A3, not options on a price list. The machines differ in optics and handling.
Explore the machine range.
Benchtop AOI that runs beside the line — prototypes, small batches, and rework.
Sits in the SMT conveyor line and inspects every board at production speed.
Adds height measurement to catch lifted leads, coplanarity, and solder-volume defects.
Built for THT and wave-soldered boards — pin protrusion, barrel fill, and joint quality.
Send us a board and we will tell you which machine it needs.
Half an hour with one of our engineers. Board size, mix and cycle time decide this, not a brochure.