Through-Hole InspectionPre-wave and post-wave.
Before soldering, detect missing, wrong and reversed components, and check pin insertion. After soldering, inspect solder quality at each through-hole pad.
AI inspection before and after soldering.
Check pin presence and insertion before soldering, then inspect solder quality at each pad after soldering. Dedicated AI algorithms handle these different inspection tasks.
Missing, wrong and reversed components.
Detect missing, wrong and reversed through-hole components with AI. Generate the inspection program from one golden board.
Train for your specific solder joints.
Extend the solder model with examples from your own production. Train it to recognize niche defects and acceptable variations in wave, selective or hand-soldered joints.
Add individual pad images or all matching pad images from a product to your training dataset.
Label solder joint images as OK or NG to teach the model your acceptance criteria.
Apply the trained model to selected pads or set it as the default for a component group. It runs alongside the existing joint and bridge checks.
Collect images, label examples, train and evaluate models directly on the machine. No internet connection or cloud account required. Model training.
See it work on your through-hole board.
Join an engineer for a live demo of programming and through-hole inspection. Review component checks and solder quality results at each pad.
See how DaoAI fits into your production line, from machine integration and operator workflows to ongoing support.